Texus製全自動高速焊錫機[DBD3570S]


点击图像可显示放大的图像。

Fully automatic solder die bonder
DBD3570S

[Texus]

技术参数表

Item Specifications
Bonding Method Solder
Chip Size □1.0mm-□6.0mm
Bonding Accuracy XY = ±50μm, Θ±3°
(Depends on chip size)
Bonding Weight 80gf~200gf
(Digital setting)
Leadframe Strip type leadframe
D-PAK, TO-126, TO-202, TO-220, TO-3P
Leadframe Length/Width Length : 150mm~250mm
Width : 15mm-70mm
Wefer Size Wafer ring outer dia : 8”
Machine Cycle Time 0.6sec./chip (depend on bonding condition)
Index Method Pin Indexing
Loader Vacuum stacker / Magazine stacker
Unloader Magazine stacker (8 Magazines)
Dimensione 1,900(W)×1,245(D)×1,680(H)mm Excludes signel tower
Weight 1,200kg (approx.)
utilites Power : AC100-200V±10%、50/60Hz
Vacuum : -0.07Mpa Over
N2 Gas : 0.2Mpa Over
Forming gas : 0.2Mpa Over
Air : 0.5Mpa Over
Operation Windows NT
Touch-screen